鏡面加工基板の製造方法

Manufacture of mirror-finished substrate

Abstract

(57)【要約】 【解決手段】(a)延性モード加工により基板の表面を 研削して、表面に扇状の加工痕を有する、Ra(表面粗 さ)が5〜300Åである表面加工基板を得る工程、 (b)工程(a)により得られる表面加工基板を仕上げ 研磨に付して、鏡面加工基板を得る工程、からなること を特徴とする鏡面加工基板の製造方法。 【効果】本発明により、端面の面だれ性やスクラッチ傷 も少なく、超平滑で良質な加工面を有する鏡面加工基板 をより効率的に製造することができる。
PROBLEM TO BE SOLVED: To conduct finish-polishing in a short time by providing a mirror- finished substrate for finish-polishing a surface processed substrate of specified surface roughness having a fan-shaped processing trace in its surface. SOLUTION: The surface of a substrate is ground by means of ductility mode processing to obtain a surface processed substrate with a fan-shaped processing trace in its surface and Ra 5-300Å. The ground substrate may be the one formed immediately after forming or burning. Recommended preset cutting-in depth should be 0.05μm or more from the viewpoint of apparatus positioning accuracy, and should be 20μm or less from the viewpoint of restraining grinding load and micro-crack generation. It is thus possible to provide a mirror-finished substrate by applying the surface-processed substrate achieved like this to finish-grinding.

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